Ideal Candidate
MSc in Electrical Engineering
10+ years physical design experience
Place-and-route tools
STA and physical verification
Floorplanning, CTS, IR-drop and EM analysis
Advanced CMOS node experience, including FinFET and/or FD-SOI, is required
Physical implementation experience for high-speed digital or mixed-signal ICs is required; implementation awareness of high-speed interfaces such as UCIe, PCIe or similar protocols is an advantage
Job Description
Technical expert responsible for physical implementation of high-speed digital and mixed-signal blocks for communication ICs
Own place-and-route implementation activities
Define physical design methodologies
Optimize PPA, timing closure and signal integrity
Coordinate implementation sign-off
Support tape-out execution
Company Description
The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation. Our commitment to pushing the boundaries of illumination, visualization, and sensing enable transformative advancements in the automotive, industrial, medical, and consumer industries.
“Sense the power of light” – our success is based on the deep understanding of the potential of light and our distinct portfolio of both emitter and sensor technologies. Approximately 19,700 employees worldwide focus on pioneering innovations alongside the societal megatrends of digitalization, smart living and sustainability. This is reflected in over 13,000 patents granted and applied. Headquartered in Premstaetten/Graz (Austria) with co-headquarters in Munich (Germany), the group achieved EUR 3.4 billion revenues in 2024.
- Aug 18, 2026
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